TopSpeed Compatibility Pack
Add-on for XDS Modula-2 / Oberon-2 compilers
Greatly simplifies TopSpeed Modula-2 source code migration
TopSpeed Compatibility Pack (TSCP) is an add-on for Native XDS-x86 and XDS-C, aimed at simplifying migration of your source code from TopSpeed Modula-2 to XDS Modula-2.
TSCP includes a special version of the respective compiler, which supports several TopSpeed-compatible language extensions, and a set of TopSpeed like libraries. Using it, you may considerably reduce the amount of changes that have to be made in your source code when porting your software from TopSpeed to XDS.
Do not expect, however, that no changes at all would be required. The differences between language standards (ISO and PIM), hardware, and operating systems are too big to be eliminated automatically at a reasonable cost. For more information, see the Chapter "TopSpeed Compatibility Pack" in Native XDS-x86 User's Guide.
Library Modules
The following TS-like library modules are included in TSCP:
| Module name | Product | ||
| Native XDS-x86 | XDS-C | ||
| Windows | Linux | ||
| BiosIO | + | + | + |
| FIO | + | +- | +- |
| FIOR | + | + | + |
| Graph | + | - | - |
| IO | + | + | + |
| Lib | + | + | + |
| MATHLIB | + | + | + |
| MsMouse | + | + | - |
| ShtHeap | + | + | + |
| Str | + | + | + |
| Window | + | + | - |
